30+ Years
COMPELMA designs and manufactures components for EMI/EMC shielding and thermal dissipation — standard or fully custom, from prototype to series production. With 90% bespoke solutions, ISO 9001:2015 quality and a presence in 27 countries, COMPELMA supplies the largest industrials. Part of Groupe ICE.
EMI Shielding & Thermal Component Range
Two complementary families — EMC shielding and thermal management — each available off-the-shelf or engineered to your exact performance, packaging and dimensions. More than 80% of solutions are custom.
EMI/IP gaskets in conductive silicone, knitted wire mesh and foam-and-fabric — for enclosure sealing, grounding and environmental protection.
Learn moreSurface-mount beryllium-copper spring contacts and flexible silicone SMD contacts for board-to-chassis grounding.
Learn moreEMI shielding cans, covers and frames (capots & ceintures) plus SMD inserts that isolate sensitive circuitry on the PCB.
Learn moreEMI/RF shielded glass and shielding film for displays and viewing windows that must combine optical clarity with attenuation.
Learn moreMicrowave absorbing foams and ferrites that suppress cavity resonance and surface currents across the hyper-frequency range.
Learn moreHeat sinks, cold plates, thermal interface materials (Fujipoly), thermal paste and Peltier modules for full thermal control.
Learn moreA selection of COMPELMA's product families. Each component can be tailored on performance, packaging and dimensions. Full catalogue on compelma.com.
Surface-mount beryllium-copper spring contacts that provide reliable grounding between the PCB and chassis or shield.
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Conductive-silicone SMD contacts that combine flexibility with shielding for compact, gasket-style board grounding.
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Conductive EMI/IP gaskets — silicone, wire mesh and foam-and-fabric profiles — for enclosure sealing and grounding.
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Board-level shielding cans, covers and frames plus SMD inserts that isolate RF circuitry directly on the PCB.
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EMI/RF shielded windows and film that maintain optical clarity while attenuating electromagnetic emissions on displays.
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Microwave absorbing foams and ferrites that suppress cavity resonance and unwanted emissions across the hyper-frequency band.
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Custom-engineered heat sinks and cold plates that draw heat away from high-power components and dissipate it efficiently.
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Thermal interface materials, gap fillers and pads (Fujipoly) that conform to surface gaps and conduct heat to the heat sink.
Read moreEvery component can be declined custom — performance, packaging, dimensions. Full catalogue on compelma.com →
COMPELMA is a supplier of standard and custom components for EMC shielding and thermal management in electronics, working with the largest industries for more than 30 years and present today in 27 countries.
With 90% custom solutions, COMPELMA designs and delivers relevant, cost-effective solutions — its core values being reactivity, innovation and partnership.
COMPELMA holds all the cutting and simulation tools to support development from prototype to series, and belongs to Groupe ICE — a federation of 20 industrial companies (1,150 people, €175M revenue, 2024).
IMPO-RF supplies and supports COMPELMA's gaskets, board-level shields, absorbers, heat sinks and thermal interfaces. Tell us your enclosure, frequency and thermal target and we'll spec the solution.
